04:17 AM EDT, 06/04/2024 (MT Newswires) -- International Business Machines ( IBM ) and Rapidus have formed a partnership to develop mass-production technologies for chiplet packages, the companies said late Monday.

Financial terms were not disclosed.

Under the agreement, IBM ( IBM ) will provide Rapidus with packaging technology for high-performance semiconductors.

IBM ( IBM ) and Rapidus engineers will work together at IBM's ( IBM ) facilities in North America for research and development and manufacture of semiconductor packaging for advanced computer systems.

The agreement is part of a project run by Japan's New Energy and Industrial Technology Development Organization.

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