10:23 AM EDT, 06/16/2025 (MT Newswires) -- Applied Materials ( AMAT ) and CEA-Leti said Monday they plan to expand their joint lab to accelerate innovation in specialty chips for markets including the Internet of Things, communications, automotive, power, and sensors.

Under a new memorandum of understanding, the lab will be upgraded with new equipment and capabilities to support full-flow development of specialty devices, moving beyond individual process steps. It will also include advanced packaging tools for heterogeneous chip integration across different wafer types and process nodes.

CEA-Leti CEO Sebastian Dauve said the first phase of the collaboration laid important groundwork for addressing materials-engineering challenges in specialty semiconductor devices.

Shares of Applied Materials ( AMAT ) were up 3% in recent trading.

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