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Besi lifts long-term targets, expecting new AI customers
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Besi lifts long-term targets, expecting new AI customers
Jun 12, 2025 7:21 AM

*

Raises long-term revenue and margin targets

*

Hybrid bonding attracts new customers

*

Shares rise 8.4%

(Adds new customers for hybrid bonding in paragraphs 3-4,

shares in paragraph 5, background in paragraphs 8-10)

By Nathan Vifflin and Leo Marchandon

AMSTERDAM, June 12 (Reuters) - BE Semiconductor

Industries (Besi) raised its long-term financial

targets ahead of its investor day on Thursday and said it

expects to see the benefits of customers adopting its advanced

chip stacking tools.

The Dutch firm makes the world's most accurate hybrid

bonding tool, a critical chip technology allowing multiple chips

to be bonded directly on top of each other.

AI chip designers Nvidia ( NVDA ) and Broadcom ( AVGO )

are looking to adopt a TSMC process using hybrid

bonding, Besi's Senior Vice President Technology Chris Scanlan

said at the event, potentially increasing demand for Besi's

tool.

Intel ( INTC ) and AMD, are also expanding their use

of hybrid bonding, Scanlan added.

Shares in Besi were up 8.4% as at 1540 GMT, topping the

Netherlands' AEX index.

Besi now expects revenue of between 1.5 billion euros and

1.9 billion euros ($1.73 billion-2.19 billion) in the "long

term", against 1 billion euros forecast earlier, with an

operating margin between 40% and 55%, up from 35% to 50%.

As performance gains from shrinking chip features reach

physical limits, chipmakers are looking towards advanced

packaging technologies such as hybrid bonding to keep making

faster and more powerful chips.

Chipmakers have also reached the limits of reticule exposure

on ASML's lithography machines, meaning they cannot

exponentially expand the size of one chip, and instead look to

stitch or stack multiple chips together.

The world's largest contract chipmaker Taiwan

Semiconductor Manufacturing Co ( TSM ), showed off in April a

dinner-plate-sized package

made of more than 16 large computing chips stitched

together.

Besi and its investors bank on its equipment being the

right tool for leading-edge chipmakers. But some analysts were

cautious about the lifting of the targets.

"We would like to point out that Besi is already raising

its long-term targets, while they have not yet come close to

their previous targets yet", analysts at Degroof Petercam said.

Shares in Besi are down 3.2% so far this year.

($1 = 0.8685 euros)

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