*

Press conference at 5.00 p.m. (0900 GMT)

*

Announced $100 billion U.S. investment earlier in week

*

U.S. President Trump has threatened to impose tariffs on

chips

(Adds more context in paragraphs 4,7, 9-11 on U.S. position and

subsidies)

By Wen-Yee Lee

TAIPEI, March 6 (Reuters) - The CEO of chipmaker TSMC

will hold a press conference at Taiwan's presidential

office at 5:00 p.m. local time (0900 GMT) on Thursday, the

president's office said, days after the company announced major

investment in the U.S. which requires government approval.

No further details were given.

Earlier this week, the world's largest contract chipmaker

announced a fresh $100 billion investment in the U.S. that

involves building five additional chip facilities there amid

threats from the U.S. President Donald Trump to impose tariffs

on semiconductor imports.

Trump has repeatedly criticised Taiwan, saying it has taken

away American semiconductor business and that he wants

manufacturing to return to the United States.

Taiwan's cabinet said on Tuesday it would review the

investment in line with its laws, which require government

approval for any large overseas investment by a Taiwan company,

but that it viewed overseas investments that would raise

Taiwan's overall competitiveness positively.

Taiwan's presidential office said earlier its review would

also consider the interests of investors and Taiwan.

Taiwan's dominant position as a maker of chips used in

technology from cellphones and cars to fighter jets has sparked

concerns of over-reliance on the island, especially as China

ramps up pressure to assert its sovereignty claims.

As a key manufacturing partner to Nvidia ( NVDA ),

Qualcomm ( QCOM ) and Advanced Micro Devices ( AMD ), TSMC is

central to the U.S. chip industry, and bringing more of its

production to U.S. soil would solve a major supply chain risk

for those firms.

Its fresh investment in the U.S., however, faces risks of

steep cost increases.

Trump said on Tuesday U.S. lawmakers should get rid of a

landmark 2022 bipartisan law to give $52.7 billion in subsidies

for semiconductor manufacturing in the U.S. and use the proceeds

to pay debt.

In the final weeks of the Biden administration, the Commerce

Department finalised more than $33 billion in awards including

$6.6 billion for TSMC.