04:34 AM EST, 01/20/2026 (MT Newswires) -- Coherent (COHR) said Monday it launched a diamond technology with a specialized surface finish that allows direct bonding to semiconductor die for electronic and opto-electronic applications.

Bondable diamond "significantly improves" device cooling performance by removing or reducing thermal interface resistance, the company said.

Coherent said direct bonding enabled by its bondable diamond lowers interface thermal resistance by up to 99%.

The company's shares were down 5.2% in recent premarket activity Tuesday.