BEIJING, June 23 (Reuters) - Huawei Technologies' new

MateBook Fold laptop is powered by an older-generation chip made

by SMIC, highlighting how U.S. export curbs are

hindering China's top foundry from advancing to next-generation

semiconductor manufacturing, Canadian research firm TechInsights

said on Monday.

There was widespread speculation in the industry that Huawei

would use SMIC's newer 5nm-equivalent N+3 process node

chip in the MateBook Fold that, according to TechInsights, marks

Huawei's "most aggressive entrance into full-stack computing;

chip design, OS development, and hardware integration".

However, the laptop instead features the Kirin X90 chip,

built on the same 7nm N+2 process node that was first introduced

in August 2023, TechInsights said in a report.

"This likely means that SMIC has not yet achieved a 5nm

equivalent node that can be produced at scale," it said.

"U.S.-imposed technology controls are likely continuing to

impact SMIC's ability to catch-up to current foundry leaders in

more advanced nodes across chips for mobile, PCs, and cloud/AI

applications," TechInsights added.

The MateBook Fold, which does not have a physical keyboard

and features an 18-inch OLED double screen, was one of two new

laptops Huawei launched last month. The devices are part of

Huawei's broader push to build a self-reliant ecosystem amid

U.S. efforts to limit its access to advanced chips.

The laptops are the first to be sold with Huawei's Harmony

operating system. It has not officially disclosed the processor

used, though past models have used Intel ( INTC ) chips.

Huawei did not immediately respond to a request for comment.

Reuters reported last year that the U.S. revoked licences

that had allowed companies including Intel ( INTC ) and Qualcomm ( QCOM )

to ship chips used for laptops and handsets to Huawei.

The U.S. curbs limited SMIC's access to advanced chipmaking

tools, including extreme ultraviolet lithography. China-based

foundries have to now rely on less efficient multi-patterning

techniques that reduce yield, the report said.

The report noted that Huawei's 7nm chip is several

generations behind those used by Apple ( AAPL ), Qualcomm ( QCOM ), and

AMD. It added that China remains at least three

generations behind the global semiconductor frontier, as

foundries like TSMC and Intel ( INTC ) prepare to roll out 2nm process

technology within the next 12 to 24 months.

Earlier this month, Huawei CEO Ren Zhengfei told Chinese

state media that Huawei's chips were just one generation behind

that of U.S. peers but the firm was finding ways to improve

performance through methods such as cluster computing.