05:55 AM EDT, 03/18/2024 (MT Newswires) -- Taiwan Semiconductor Manufacturing ( TSM ) is considering the development of advanced packaging capacity in Japan, Reuters reported Monday, citing people familiar with the matter.

The chipmaker is reportedly considering bringing its chip on wafer on substrate packaging technology to Japan. All of that technological capacity is currently in Taiwan, according to the report.

Deliberations are still in the early stages, Reuters reported.

Taiwan Semiconductor did not immediately respond to MT Newswires' request for comment.

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