04:27 AM EST, 01/08/2025 (MT Newswires) -- Micron Technology ( MU ) said late Tuesday that it broke ground on a packaging unit adjacent to its facilities in Singapore to meet the growing demand for advanced memory and storage solutions induced by artificial intelligence.

While operations at the high-bandwidth memory packaging facility will likely begin in 2026, a "meaningful expansion" of packaging capacity will start in 2027, the company said.

Micron, whose current facility in Singapore is a front-end semiconductor fab, plans to invest about $7 billion through the end of the decade and beyond in high-bandwidth memory advanced packaging.