SEOUL, Sept 26 (Reuters) - The world's second-largest
memory chipmaker SK Hynix ( HXSCF ) said on Thursday it began
mass production of a 12-layer version of the latest generation
of high-bandwidth memory (HBM) chips, to meet demand from the
current AI boom.
The Nvidia ( NVDA ) supplier said in a statement it was the
world's first latest-generation HBM product, called HBM3E, with
12-layers and the largest capacity of existing HBM to date at 36
gigabytes.