SEOUL, Sept 26 (Reuters) - The world's second-largest

memory chipmaker SK Hynix ( HXSCF ) said on Thursday it began

mass production of a 12-layer version of the latest generation

of high-bandwidth memory (HBM) chips, to meet demand from the

current AI boom.

The Nvidia ( NVDA ) supplier said in a statement it was the

world's first latest-generation HBM product, called HBM3E, with

12-layers and the largest capacity of existing HBM to date at 36

gigabytes.