09:49 AM EDT, 10/28/2025 (MT Newswires) -- ON Semiconductor (ON), also known as onsemi, said Tuesday that Teledyne Technologies ( TDY ) selected its Treo platform to develop readout integrated circuit chips for infrared imaging systems.

Financial terms were not provided.

The company said the Treo platform is built on a 65-nanometer process and uses modular architecture with integrated circuit components aimed at reducing development time.

The platform combines its readout integrated circuit technology with Treo's analog, digital, and low-power capabilities to support applications in aerospace, defense, security, and science, according to onsemi.

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