SEOUL, Sept 12 (Reuters) - South Korea's SK Hynix ( HXSCF )

said on Friday it has completed its internal

certification process for next generation high-bandwidth memory

4(HBM4) chips and established a production system for customers.

In March, the South Korean chipmaker, a key supplier to AI

giant Nvidia ( NVDA ), said it had shipped its HBM4 12-layer

chip samples to customers, adding that the company aims to

complete preparations for mass production of 12-layer HBM4

products within the second half of this year.

HBM - a type of dynamic random access memory or DRAM

standard first produced in 2013 - involves stacking chips

vertically to save space and reduce power consumption, helping

to process the large volumes of data generated by complex AI

applications.