02:04 PM EDT, 06/24/2024 (MT Newswires) -- Synopsys ( SNPS ) said Tuesday its AI-driven multi-die reference flow chip manufacturing technology is now available for Intel ( INTC ) unit Intel Foundry's embedded multi-die interconnect bridge advanced packaging technology.

The optimized reference flow aims to streamline co-design and analysis processes for multi-die designs, from initial silicon development to final system integration, Synopsys ( SNPS ) said.

Combining Synopsys ( SNPS ) 3DIC Compiler and Synopsys IP will improve both efficiency and accuracy compared to manual flows.

Shares of Synopsys ( SNPS ) were down 1.2% in recent trading.

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