WASHINGTON, March 3 (Reuters) - TSMC CEO C. C.

Wei plans to meet with President Donald Trump on Monday to

discuss the Taiwanese semiconductor company's new $100 billion

investment plans in the United States.

A person briefed on the matter said Taiwan Semiconductor

Manufacturing Co. ( TSM ) is expected to announce a $100 billion

investment in the United States. In April, TSMC agreed to expand

its planned U.S. investment by $25 billion to $65 billion and to

add a third Arizona factory by 2030.

The U.S. Commerce Department under then President Joe Biden

finalized a $6.6 billion government subsidy in November for

TSMC's U.S. unit for semiconductor production in Phoenix,

Arizona.

TSMC said it looks "forward to discussing our shared vision

for innovation and growth in the semiconductor industry, as well

as exploring ways to bolster the technology sector along with

our customers."

Biden signed the CHIPS and Science Act legislation in 2022

to provide $52.7 billion in subsidies for American semiconductor

production and research to boost domestic production and make

the United States less reliant on semiconductors made in Asia.

Trump's Commerce Secretary Howard Lutnick told lawmakers

last month that the program was "an excellent down payment" to

rebuild the sector but he has declined to commit grants that

have already been approved by the department, saying he wanted

to "read them and analyze them and understand them."

A TSMC spokesperson said last month the company had received

$1.5 billion in CHIPS Act money before the new administration

came in as per the milestone terms of its agreement.

TSMC last year agreed to produce the world's most advanced

2-nanometer technology at its second Arizona fab expected to

begin production in 2028. TSMC also agreed to use its most

advanced chip manufacturing technology called "A16" in Arizona.

The TSMC award included up to $5 billion in low-cost

government loans.