US announces $1.4 billion support for next-generation semiconductor advanced packaging-February 2024-www.financetom.com

US announces $1.4 billion support for next-generation semiconductor advanced packaging

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US announces $1.4 billion support for next-generation semiconductor advanced packaging

Jan 16, 2025 2:41 AM

(Reuters) - The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

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