WASHINGTON ,Dec 20 (Reuters) - The U.S. Commerce

Department said on Friday it finalized an award to Amkor

Technology ( AMKR ) of up to $407 million to help fund the

company's planned $2 billion advanced semiconductor packaging

facility in Arizona.

The plant is set to be the largest of its kind in the U.S.

and when fully operational will package and test millions of

chips for autonomous vehicles, 5G/6G and data centers. Apple ( AAPL )

will be its first and largest customer with the chips

produced at a nearby Taiwanese chipmaker TSMC

facility.