10:00 AM EDT, 08/14/2024 (MT Newswires) -- Veeco Instrument (VECO) said Wednesday that IBM ( IBM ) has selected its WaferStorm wet-processing system and has entered into a joint development agreement with Veeco to explore advanced packaging applications using multiple wet processing technologies.

Veeco said the agreement requires the WaferStorm system to be installed at the Albany NanoTech Complex in upstate New York, where IBM ( IBM ) and other industry partners are developing advanced packaging and chiplet technologies.

The WaferStorm system enables a variety of hybrid bonding and cleaning processes for both 40- and 60- nanometer chips and also allows multiple processes to be performed on a single platform with minimal hardware modifications.

Financial terms of the new partnership were not disclosed.

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