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Broadcom Innovates with New Sian3 and Sian2M DSPs, Cutting Power for Scalable AI/ML Connectivity
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Broadcom Innovates with New Sian3 and Sian2M DSPs, Cutting Power for Scalable AI/ML Connectivity
Mar 25, 2025 8:07 AM

Broadcom Inc. ( AVGO ) on Tuesday disclosed the expansion of its leading 200G/lane DSP PHY portfolio with the introduction of the Sian3 and Sian2M.

The portfolio is designed specifically to meet the connectivity demands of AI/ML clusters.

These advancements address the critical need for optimized power management across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links, particularly in 800G and 1.6T optical transceiver applications.

Broadcom’s new Sian3 and Sian2M DSPs, combined with its comprehensive 200G/lane laser portfolio, offer exceptional power efficiency and cost optimization, supporting the next generation of AI infrastructure.

Broadcom's ( AVGO ) Sian3 reduces power by over 20% compared to the Sian2.

The Sian2M is optimized for 800G and 1.6T short-reach MMF links in AI clusters, integrating VCSEL drivers and Broadcom's ( AVGO ) 200G VCSEL technology to boost performance and efficiency. Broadcom ( AVGO ) has deployed over 50 million channels of 100G VCSELs in AI networks.

Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom ( AVGO ) said, “Our new 3nm Sian3 delivers over 20% power reduction for 1.6T optical modules, while Sian2M with integrated VCSEL drivers and 200G VCSELs brings cost and power efficiency to short-reach links. These innovations enable our customers to scale AI clusters to meet the demands of growing AI workloads.”

Investors can gain exposure to the stock via EA Series Trust Strive U.S. Semiconductor ETF and VanEck Fabless Semiconductor ETF ( SMHX ) .

Price Action: AVGO shares are down 0.16% at $190.94 at the last check Tuesday.

Read Next:

Intel Targets Nvidia, Broadcom With Renewed Chip Design And Foundry Push, Says UBS

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