financetom
Technology
financetom
/
Technology
/
Chipmaker NXP gets 1 bln euro loan from EIB for European projects
News World Market Environment Technology Personal Finance Politics Retail Business Economy Cryptocurrency Forex Stocks Market Commodities
Chipmaker NXP gets 1 bln euro loan from EIB for European projects
Jan 15, 2025 6:28 AM

NIJMEGEN, Netherlands, Jan 15 (Reuters) -

N etherlands-based computer chip maker NXP said on

Wednesday it has secured a 1 billion euro ($1.03 billion)loan

from the European Investment Bank (EIB) to support research and

development projects in five European countries.

The EIB, the European Union's long-term lending institution,

said the loan was part of a investment programme it launched

last year aimed at strengthening Europe's position in strategic

technologies including microchips and artificial intelligence.

NXP, one of the largest makers of semiconductors used in

cars, said it would draw on the six-year loan facility, which

carries a 4.75% interest rate, for projects in Austria, France,

Germany, the Netherlands and Romania.

Apart from the pure research and development of new power

electronics devices, microprocessors and microcontrollers, NXP

will also focus on the energy efficiency of its devices, it said

in a statement.

Europe must "remain an indispensable player in the value

chains of critical technologies," EIB manager Robert de Groot

said in a statement.

"Semiconductors are key to the digital and green

transitions."

Earlier this month NXP announced a $625 million acquisition

of Austria's TTTech Auto.

($1 = 0.9710 euros)

Comments
Welcome to financetom comments! Please keep conversations courteous and on-topic. To fosterproductive and respectful conversations, you may see comments from our Community Managers.
Sign up to post
Sort by
Show More Comments
Related Articles >
Bharti Airtel Announces a Strategic Partnership with IBM to Augment Airtel Cloud
Bharti Airtel Announces a Strategic Partnership with IBM to Augment Airtel Cloud
Oct 15, 2025
NEW DELHI and MUMBAI and ARMONK, N.Y., Oct. 15, 2025 /PRNewswire/ -- Bharti Airtel, one of India's leading telecommunications service providers has entered into a strategic partnership with IBM ( IBM ) to augment its recently launched Airtel Cloud. The partnership is expected to bring together the telco-grade reliability, high security, and data residency of Airtel Cloud with IBM's ( IBM...
GigaDevice and Navitas Unveil Digital Power Joint Lab to Accelerate High-Efficiency Power Management Deployment
GigaDevice and Navitas Unveil Digital Power Joint Lab to Accelerate High-Efficiency Power Management Deployment
Oct 15, 2025
BEIJING--(BUSINESS WIRE)-- GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has announced the official launch of the Digital Power Joint Lab in collaboration with Navitas Semiconductor ( NVTS ) . By combining GigaDevice’s GD32MCU expertise with Navitas’ advantages in high-frequency, high-speed, and highly integrated GaN technologies, and its GeneSiC™ technology leveraging ‘trench-assisted...
Wytec International “Rapidly” Expands Revenue Generation with Over 200 Telecom Channel Partners
Wytec International “Rapidly” Expands Revenue Generation with Over 200 Telecom Channel Partners
Oct 15, 2025
SAN ANTONIO--(BUSINESS WIRE)-- Wytec International, Inc. ( WYTC ) (“Wytec” or the “Company”), a leader in smart-city and wireless innovation, announces the incorporation of over 200 Telecom Channel Partners with advanced telecommunications experience in selling Wytec’s Integrated Public Safety Solution (IPSS), consisting of both AI Gunshot and Vape Sensing Technology. “The advanced AI sensor technology incorporates a private long-term evolution...
xMEMS Appoints Veteran ASIC Leader Dr. Chester Hwang as Chief Technology Officer
xMEMS Appoints Veteran ASIC Leader Dr. Chester Hwang as Chief Technology Officer
Oct 15, 2025
SANTA CLARA, Calif.--(BUSINESS WIRE)-- xMEMS Labs, Inc., the leader in solid-state MEMS speakers and micro-scale thermal management, today announced the appointment of Dr. Chester Hwang as Chief Technology Officer. Dr. Hwang brings more than two decades of leadership in the semiconductor industry with deep expertise in high-voltage mixed-signal ASIC design, a critical capability as xMEMS advances its Sound from Ultrasound™...
Copyright 2023-2026 - www.financetom.com All Rights Reserved