Huawei Technologies Co. is reportedly nearing the completion of a major chip research and development center in Shanghai, signaling a significant boost to China’s technological ambitions despite ongoing U.S. efforts to curb its rise.

The center aims to achieve breakthroughs in semiconductors for devices, wireless networks, and the Internet of Things, reported Bloomberg.

This new facility, located in the Qingpu district, will be Huawei’s largest research center globally, housing approximately 30,000 personnel.

The expansive site spans 1.6 million square meters and includes its own road network, a small railway system, and elevated bridges, the report highlighted.

The total investment for the facility is 10 billion yuan ($1.4 billion). Huawei’s commitment to advancing its semiconductor capabilities comes amid persistent U.S. sanctions and export controls aimed at limiting the company’s progress in the tech sector.

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Last year, Huawei launched a new 5G phone featuring an advanced made-in-China 7-nanometer chip, successfully navigating U.S. restrictions.

The Biden administration has intensified efforts to curb Huawei’s chip advancements by imposing further restrictions and urging allies to add new limitations on China’s semiconductor sector.

Additionally, licenses that previously allowed Huawei to purchase some chips from Qualcomm Inc. ( QCOM ) and Intel Corp. ( INTC ) have been revoked to close any loopholes.

The tech industry is closely watching the anticipated release of Huawei’s next flagship smartphone, the Mate 70, later this year.

The report further added that the Mate 60, its predecessor, saw strong demand from local consumers, boosting Huawei’s market share at the expense of competitors such as Apple Inc. ( AAPL ) .

Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.

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