WASHINGTON, March 1 (Reuters) - The U.S. Army Corps ofEngineers is conducting an environmental review of Micron'splans for a manufacturing mega campus to make dynamicrandom-access memory chips in central New York state, the agencysaid on Friday.

Micron intends to invest up to $100 billion over the next20-plus years to construct the 1,400-acre (570-hectare) campusin Clay, New York, with $20 billion planned by 2030.

The company has applied for funding under the CommerceDepartment's $39 billion "Chips and Science" semiconductorsubsidy program, and an environmental review is required if theproject receives government funding, the agency said.

Micron plans to starting building next year, with two of thefour planned 600,000-square-foot (56,000-square-meter)fabrication units open by 2029, according to the filing.

The planned project includes constructing a childcare andhealth care center, a connection to the National Grid substationand a rail spur, according to the filing. Two more fabs would beoperational by 2041, according to the filing.

The Commerce Department declined to comment. Micron said thegovernment notice "is an important step towards preparations forconstruction - a process that includes extensive environmentalreviews defined by federal law."

A March 19 meeting on the environmental review is planned.

The review will take at least a few months, beginning with a30-day period for public input on the scope. A draftenvironmental impact statement will be available for publiccomment for 45 days before it can be finalized.

So far the Commerce Department has announced $1.7 billion inplanned subsidies from the program, including $1.5 billion toGlobalFoundries ( GFS ) to build a semiconductor production facility inMalta, New York and expand operations there and in Burlington,Vermont.

The department in January announced a $162 million plannedaward to Microchip Technology ( MCHP ) and $35 million to a BAE Systemsfacility in New Hampshire in December.

Commerce Secretary Gina Raimondo said on Monday chipcompanies should expect significantly fewer subsidies than theysought, adding that the department is prioritizing projects thatwill be operational by 2030.

The department plans to invest $28 billion in leading-edgechip manufacturing, but those companies have requested more than$70 billion. Raimondo said the department is in toughnegotiations with individual companies.