By Arsheeya Bajwa and Joyce Lee

March 26 (Reuters) - South Korean chipmaker SK Hynix

, an Nvidia ( NVDA ) supplier, is planning to invest

roughly $4 billion to build an advanced chip packaging facility

in West Lafayette, Indiana, the Wall Street Journal reported on

Tuesday.

Operations at the facility could begin in 2028, the report

said, citing people familiar with the matter.

SK Hynix is reviewing its plans to set up an advanced

chip packaging investment in the U.S., but has yet to decide, it

said in a statement.

The facility is expected to add 800 to 1,000 new jobs,

according to the report.

SK pledged in 2022 to invest $15 billion in the

semiconductor industry through research and development

programs, materials, and the creation of an advanced packaging

and testing facility in the United States.

This month, the world's second-largest memory chipmaker

began mass production of next-generation high-bandwidth memory

(HBM) chips used in artificial intelligence chipsets, with

sources saying initial shipments will go to Nvidia ( NVDA ).

SK Hynix has been the sole supplier of the version

currently used - the HBM3 - to Nvidia ( NVDA ) which has 80% of the

market for AI chips.