Santa Clara, CA and Kyoto, Japan, March 12, 2026 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the increasing importance of energy conservation, these products promote the adoption of high-efficiency power conversion using SiC in a wider range of applications.

These products are available for online purchase from online distributors such as DigiKey. and Farnell 

TRCDRIVE pack™   |   $650.0/unit (tax excluded)

1200V  A type (Small) (BST400D12P4A101)

HSDIP20   |    $180.0/unit (tax excluded)  

750V    4-in-1 (BST91B1P4K01),  6-in-1(BST91T1P4K01,  BST47T1P4K01)

1200V  4-in-1 (BST70B2P4K01)

DOT-247   |   $100.0/unit (tax excluded)

1200V Half Bridge (SCZ4011KTA

Other part numbers will be available for sale sequentially.

TRCDRIVE pack™

TRCDRIVE pack™ is a 2-in-1 SiC molded module compatible with traction inverters for xEV (electric vehicles) up to 300kW. ROHM’s 4th Generation SiC MOSFETs with low ON resistance are built in - resulting in an industry-leading power density 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs. Furthermore, its unique terminal layout allows easy connection by simply pushing the gate driver board from the top, reducing installation time considerably.

Application Examples

Automotive equipment: xEV traction inverters

Related Information

News Release: ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV InvertersDesign Models are available on the product webpage

HSDIP20

The HSDIP20 is a SiC module in 4-in-1 and 6-in-1 configurations, ideal for xEV onboard chargers (OBC), EV charging stations, server power supplies, AC servos, and similar applications. The lineup includes six models rated at 750V and seven products rated at 1200V. All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits.

 Application Examples

 Automotive equipment: OBC, DC-DC converters, electric compressors

 Industrial equipment: EV charging stations, V2X systems, AC servos, server power supplies,

 PV inverters, power conditioners

Related Information

News Release: ROHM Develops New High Power Density SiC Power Modules: Compact high heat dissipation design sets a new standard for OBCsDesign Models are available on the product webpage

DOT-247

The DOT-247 is a 2-in-1 SiC module ideal for industrial applications such as PV inverters and UPS systems. The module retains the versatility of the widely adopted "TO-247" package while achieving high power density. Furthermore, it supports various circuit configurations through two topologies: half-bridge and common-source. By adopting it in power conversion circuits that incorporate multiple discrete components, it reduces the number of components and mounting area, contributing to circuit miniaturization and reduced design effort.

Application Examples

Automotive equipment: ePTO (Electric Power Take-Off), boost converters for FCVs (fuel cell vehicles)

Industrial equipment: PV inverters, UPS (uninterruptible power supply), AI servers/data centers,

EV charging stations, semiconductor relays, eFuse

Related Information

News Release: ROHM Launches 2-in-1 SiC Molded Module “DOT-247”: Achieves high design flexibility and power densityDesign Models are available on the product webpage

EcoSiC™ Brand

EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.

• TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.

CONTACT:

Heike Mueller

ROHM Semiconductor

[email protected]

1-408-720-1900

Attachment

ROHM's New SiC Molded Modules: TRCDRIVE pack™, HSDIP20 and DOT-247

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Source: ROHM Semiconductor