SEOUL, June 9 (Reuters) - Samsung Electronics ( SSNLF ) is

considering the construction of an advanced semiconductor

packaging facility in the southwestern South Korean city of

Gwangju, the Korea Economic Daily said on Tuesday.

Here are some details:

* Samsung is expected to unveil the investment plan at a

meeting between South Korean President Lee Jae Myung and the

heads of the country's largest conglomerates on June 29, the

newspaper reported, citing unnamed industry sources.

* The meeting, to be held at the presidential office under

the theme of a "major shift in growth strategy," is expected to

include Samsung Electronics ( SSNLF ) Chairman Jay Y. Lee and SK Group

Chairman Chey Tae-won.

* Separately, SK Hynix is also considering

building a new chip packaging production facility in the

southwestern region, particularly in South Jeolla Province,

daily newspaper Dong-a reported on Wednesday.

* Samsung Electronics ( SSNLF ) and SK Hynix declined to comment. The

presidential office said corporate investment decisions are

matters for companies to determine.

* The move would mark one of Samsung's latest efforts to

strengthen its advanced chip packaging capabilities, a critical

part of the AI chip supply chain as demand surges for

high-bandwidth memory chips used in AI servers.

* The Korea Economic Daily said that Samsung's investment

would be seen as a sign that the company is seeking to

accelerate spending ahead of what many expect to be an upswing

in the chip sector driven by AI demand.

* Advanced packaging has become increasingly important as

chipmakers seek to improve performance by integrating multiple

chips into a single package. Demand has been particularly strong

for HBM, which stacks multiple DRAM chips vertically and is used

alongside AI processors from companies such as Nvidia ( NVDA ).

* Samsung's customers include major AI players such as

Nvidia ( NVDA ), AMD and Google, which are

driving demand for advanced memory chips used in AI servers and

processors.

* Samsung has been expanding its presence in the HBM market

as it seeks to challenge market leader SK Hynix. In

May, the company said it had begun shipping samples of its

latest HBM chip, the 12-layer HBM4E, to customers.

(Reporting by Heekyong Yang; Editing by David Holmes and Mrigank

Dhaniwala)