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xMEMS Appoints Veteran ASIC Leader Dr. Chester Hwang as Chief Technology Officer
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xMEMS Appoints Veteran ASIC Leader Dr. Chester Hwang as Chief Technology Officer
Oct 15, 2025 6:30 AM

SANTA CLARA, Calif.--(BUSINESS WIRE)--

xMEMS Labs, Inc., the leader in solid-state MEMS speakers and micro-scale thermal management, today announced the appointment of Dr. Chester Hwang as Chief Technology Officer. Dr. Hwang brings more than two decades of leadership in the semiconductor industry with deep expertise in high-voltage mixed-signal ASIC design, a critical capability as xMEMS advances its Sound from Ultrasound™ audio platform and its revolutionary µCooling™ air-pump-on-a-chip thermal management solutions.

“We are thrilled to welcome Chester to xMEMS as our new CTO,” said Joseph Jiang, Co-Founder and CEO of xMEMS Labs. “I have known Chester for some time and have always admired his exceptional technical background, especially in high-voltage mixed-signal design. His expertise will be instrumental as we scale our Sycamore and Cypress MEMS speakers and extend our µCooling air-pump-on-a-chip platform into new markets. xMEMS is fortunate to have his leadership as we enter our next phase of growth.”

Dr. Hwang’s appointment strengthens xMEMS’ technical leadership as the company accelerates commercialization of Sycamore, the world’s first MEMS loudspeaker platform enabling thin, lightweight form factors for conversational AI devices, and Cypress, the industry’s first full-range MEMS speaker for noise-cancelling earbuds. In parallel, xMEMS is preparing its µCooling solution for deployment across consumer, datacenter, and computing platforms where compact and efficient thermal management is critical.

For more information on xMEMS, visit www.xmems.com. For hi-res imagery, click here.

About xMEMS Labs, Inc.

Founded in 2018, xMEMS Labs is redefining sound and cooling with its breakthrough piezoMEMS platform. The company created the world’s first solid-state MEMS speakers, delivering superior clarity and reliability for AI glasses, earbuds, headphones, and wearables, and developed the industry’s first µCooling fan-on-a-chip, enabling active thermal management in smartphones, AI glasses, SSDs, and beyond.

With over 250 granted patents worldwide, xMEMS is driving the transition to silicon-based audio and thermal solutions.

For more information, visit www.xmems.com.

Source: xMEMS Labs, Inc.

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