TAIPEI, Sept 4 (Reuters) - SK Hynix ( HXSCF ), the

world's second-largest memory chip maker, will start mass

production of HBM3E 12-layer chips by the end of this month, a

senior executive said on Wednesday.

Justin Kim, president and head of the company's AI Infra

division, made the comment at the Semicon Taiwan industry forum

in Taipei.

In July, the South Korean company disclosed plans to

ship the next versions of HBM chips - the 12-layer HBM3E -

starting in the fourth quarter and the HBM4 starting in the

second half of 2025.

High bandwidth memory (HBM) is a type of dynamic random

access memory, or DRAM, standard first produced in 2013 in which

chips are vertically stacked to save space and reduce power

consumption. They are advanced memory chips capable of handling

generative artificial intelligence (AI) work.

A key component of graphics processing units (GPUs) for

AI, it helps process massive amounts of data produced by complex

applications.

In May, SK Hynix ( HXSCF ) CEO Kwak Noh-Jung said its HBM chips were

sold out for this year and almost sold out for 2025.

There are only three main manufacturers of HBM - SK

Hynix ( HXSCF ), Micron and Samsung Electronics ( SSNLF ).

SK Hynix ( HXSCF ) has been the main supplier of HBM chips to

Nvidia and supplied HBM3E chips in late March to a customer it

declined to identify.