TAIPEI, Sept 4 (Reuters) - SK Hynix ( HXSCF ), the

world's second-largest memory chip maker, will start mass

production of HBM3E 12-layer chips by the end of this month, a

senior executive said on Wednesday.

Justin Kim, president and head of the company's AI Infra

division, made the comment at the Semicon Taiwan industry forum

in Taipei.

In July, the South Korean company disclosed plans to

ship the next versions of HBM chips - the 12-layer HBM3E -

starting in the fourth quarter and the HBM4 starting in the

second half of 2025.